Adhesion Forces Reduction by Oscillation for Micro Manipulation

In the micro region, for scale effect, the force (attracting force) proportional to the area and length of van der Waals attraction, surface tension, and electrostatic force become dominant compared to the force proportional to the force of gravity and inertia. These attracting forces create an adhesion force between the target object and tool. To cope with this adhesion force, we are proposing a method of mitigating adhesion force through vibration. By minutely vibrating the end-effector and contacting it (bringing it near to) with the physical object on the table (foundation), the adhesion force between the end-effector and physical object will become small compared to the force between the table (foundation) and physical object. By applying this method, we can manipulate objects in the same way as manipulation of the micro region. Based on this method, we are developing methods of automatically conducting various macro manipulation.

Related works

  • Tetsuyou Watanabe and ZhongWei Jiang,
    Adhesion Forces Reduction by Oscillation and Its Application to Micro Manipulation,
    Cutting Edge Robotics 2010. doi:10.5772/10304(IN-TECH).
  • Tetsuyou Watanabe , Makoto Iwasaki, Hidekazu Matsumura, and ZhongWei Jiang, Study on Adhesion Force Reduction and State Estimation by Piezo-transducer, Proceedings of the IEEE International Conference on Robotics and Automation (ICRA), pp.2211-2216, 2009.
  • Tetsuyou Watnabe, Yutaka Serita, Adhesion state detection by vision and its application to automatic micro manipulation, Proceedings of the IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), pp.458-463, 2008.
  • Tetsuyou Watanabe and Zhongwei Jiang, ``Mechanism of Micro Manipulation using Oscillation'',
    Proceedings of the IEEE International Conference on Robotics and Automation (ICRA), pp.661-668, 2006.
  • Tetsuyou Watanabe,Zhongwei Jiang and Tsuneo Yoshikawa, ``
    Mechanics of Hybrid Active/Passive-Closure Grasps
    Proceedings of the 2004 IEEE International Conference on Robotics & Automation, pp.1252-1257, 2004.